会议名称(中文)： 第11届国际热管研讨会
会议名称(英文)： The 11th International Heat Pipe Symposium (11IHPS)
所属学科： 基础物理学,工程热物理,热工学
开始日期： 2013-06-09
结束日期： 2013-06-12
所在国家： 中华人民共和国
所在城市： 北京市 东城区
具体地点：
主办单位： 中国航天空气动力技术研究院
协办单位：
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议题：
[ 组织结构 ] 会议主席：
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会议嘉宾： 姓名 职务 简介 演讲题目
[ 重要日期 ] 摘要截稿日期： 2012-10-15
全文截稿日期： 2013-01-15
论文录用通知日期： 2013-03-01
参会报名截止日期： 2013-03-15
[ 会务组联系方式 ] 联系人： Changchang Liu / Fang Han
联系电话： +86-10-68192611
传真： +86-10-68374758
E-MAIL： ihps11@hotmail.com
通讯地址：
邮政编码：
会议注册费：
会议网站： http://www.ihps11.aeroepoch.com/aero701home/IHPS11EN/index.asp
会议背景介绍： The 11th International Heat Pipe Symposium (11IHPS) will be held in Beijing, China, June 9-12 (Sunday-Wednesday), 2013. The symposium is planned to provide a forum for exchange of fundamental and application results and experience in the field of heat transfer and thermal engineering especially related to heat pipes. Further, the international symposium will also show the world wide state-of-the-art of heat pipe technology. A number of keynote papers will be invited and presented in selected fields internationally. Panel discussion meeting and forums for topics are also planned. The keynote speakers will be awarded together with authors of best paper awarded.
征文范围及要求： TOPICS FOR THE SYMPOSIUM
1. Fundamental researches related with physical phenomena in various heat pipes: heat transfer with phase change, heat transfer in porous media, fluid dynamics of vapor and liquid flows with the influences of mass forces.
2. Heat pipes, thermosyphons, pulsating heat pipes, flat plate heat pipes, vapor chambers, separate heat pipes: theoretical and experimental investigations.
3. New structural designs and applications of heat pipes: micro heat pipes, loop heat pipes, capillary pumped loops and their applications in thermal management, etc.
4. Heat pipe storage systems, such as concentrating solar power station, industrial heat recovery, recuperators, etc.
5. Heat pipe applications in metallurgical industry, material processing and heat recovery industries, including new designs, fluids, materials, modeling of corrosion and life tests, etc.
6. Thermal control applications of microelectronics and power devices.
7. Aerospace design and applications of heat pipes, including spacecraft thermal control, space power systems, space station experiments and temperature control of supersonic flights, etc.
8. Other state-of-the-art development and application of heat pipe components.
